HLK-RM56 Hongmeng AIoT 5G dual-band WiFi Bluetooth development board

$481.00

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5G dual-band WiFi Bluetooth Hongmeng AIoT module RM56 development board Hengxuan BES2600W IoT
core board, 2.4G/5.8G dual-band WiFi+BLE Bluetooth 5.0.

Category:

The RM56 development board is based on the Hengxuan BES2600WM chip. It is a high-performance, multi-functional, and cost-effective AloT SoC development board. It supports the open-source Hongmeng system and is suitable for various AloT multi-modal VUI+GUI interactive hardware scenarios.

Hi-Link HLK-RM56-KIT developer board

HLK-RM56 BES2600W core board

Product features:
• Single-module integrated quad-core ARM processor (maximum frequency 1GHz),
• Integrated dual-band WiFi + dual-mode Bluetooth
• Support standard 802.11a/b/g/n
• Support BT/BLE52 protocol
• Built-in various capacity RAM (up to 42MB) and NOR Flash (up to 32MB)
• Support 2LANE MIPI DSI and CSI

HLK-RM56 5G dual-band wifi bluetooth

Product parameters:

Wireless parameters:
Wireless standard IEEE 802.11a/b/g/n
Wireless transmission rate 11a: up to 450Mbps; 11n: up to 150Mbps; 11g: up to 54Mbps; 11b: up to 11Mbps
Number of channels 1-14
Frequency range 2.412-2.484GHz5180-5.825GHz
Transmit power 13-20dBm
Antenna:
Antenna type External antenna (dual-band 24/5.8G antenna)
Software parameters:
Wireless mode AP/STA
Wireless security Wireless MAC address filtering; wireless security function switch: WPA-PSK/WPA2-PSK security mechanism;
Firmware upgrade 64/128/152-bit WEP encrypted serial port upgrade/wireless upgrade
Network protocol IPv4, TCP/UDP
User configuration AT+ command set, one-key network configuration
Serial port to network:
Serial baud rate 110~1500000bps
TCP Client 1
Other parameters:
Environmental standards Working temperature: -30~+80℃

Working humidity: 10%~90%RH (non-condensing)

Storage temperature: -20~+80℃

Storage humidity: 5%~90%RH (non-condensing)

Size 40*29*9.4mm
Package form SMD
Antenna type External antenna (2.4G/5.8G dual-band antenna)

5G dual-band WiFi Bluetooth Hongmeng development board

Development board function modules and interface distribution:

Hongmeng AIoT module RM56 development board

No. Functional description
1 DEBUG USB and 5V power supply input
2 HOST USB (OTG external USB device power supply)
3 GND test point, the pin is empty by default
4 LED1 and LED2 indicators
5 Analog microphone left MIC3, right MIC2
6 Digital Microphone (Analog or Digital)
7 Infrared receiver
8 Infrared emission
9 Battery and charging IC
10 USB to serial chip (connection 1)
11 ADC button; 13.GPIO button
12 Power button and reset button
13 Power selection
14 ADC test (with KEY_SENS)
15 SPKR back sampling signal test point
16 External antenna test point, onboard by default
17 HLK-RM56 module, pay attention to the avoidance area
18 LCD reinforcement board, broken off
19 GPIO test, the left row is GND
20 GPIO test
21 SD or EMMC test
22 Audio amplifier
23 Speaker interface
24 LCD interface, 27. Backlight IC
25 Micro SD (TF) card
26 Camera interface
27 The external flash is on the module and can be directly replaced on the main chip (default 1.8V)
28 TF (Micro-SD) card slot, support plug-in detection
29 Camera module FPC seat, 24pin, bottom connection, 0.5mm pitch

 

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