MYD-YT113S3 development board

The MYC-YT113X development board is an entry-level, low-cost, extreme dual-core A7 processor made in China. It aims to provide developers with a stable reference design and a complete software development environment, which can effectively help developers improve development efficiency, shorten development cycles, optimize design quality, and speed up product development and time to market.

Product features:
1) Cost-effective, entry-level embedded processor
Allwinner T113-S3 processor, dual-core A7@1.2GHz, suitable for low-cost gateway products and commercial display products, with rich multimedia interface MIPI-DSI/RGB/LVDS/Parallel CSI, supporting 1080P@60FPS display. In addition, the camera interface ( Parallel-CSI), display interface (MIPI-DSI/LVDS/RGB), USB2.0 interface, CAN interface, Gigabit Ethernet and other interfaces.

2) Reliable quality and high-cost performance;
a. SMD patch welding, the core board, and the bottom board are welded by SMD, which is tight and firm, and the supply is stable;
b. Output 140Pin signal, the pin is stamped hole package, and the pin contains rich peripheral resources;
c. 6-layer PCB design, immersion gold process production, independent ground signal layer, lead-free.

3) Support video decoding and display
a. Support H.265/H.264 1080P@60FPS video decoding
b. JPEG/MJPEG 1080P@60FPS video encoding
c. Rich multimedia interface, MIPI-DSI/ RGB /LVDS / Parallel CSI

4) Rich peripheral expansion signals
The MYC-YT113X core board leads 140 PINs for signals and power grounds through stamp holes, and these signal pins contain a wealth of peripheral resources.

Core board annotation diagram, frame diagram:

MYC-YT113X core board annotation diagram

MYC-YT113X core board system block diagram

MYC-YT113X core board system block diagram

Core board resources and parameters:

Name	Configuration	Optional
Processor model	T113-S3, 2*Cortex-A7@1.2G
Power management	Discrete power supply
Memory	Built-in 128MB DDR3
Memory	Standard 4GB eMMC / 256MB Nand FLASH	eMMC optional 8GB
Other storage	32KB EEPROM
Interface Type	Stamp hole, 140PIN
Operating temperature	Industrial grade: -40℃-85℃
Mechanical Dimensions	37mm x 39mm
Operating system	Linux 5.4

Core board extension signal:

Project	Parameter
Ethernet	RGMII/RMII x1
USB	2*USB2.0
UART	6*UART
CAN	2*CAN
TWI	4*TWI
SPI	2*SPI
ADC	1*GPADC；4*TPADC
DISPLAY	1*MIPI DSI；1*RGB；2*LVDS
CAMERA	1* Parallel CSI
AUDIO	2* I2S

Annotated diagram and frame diagram of the development board kit:

MYD-YT113X development board front label drawing

MYD-YT113X development board back label drawing

MYD-YT113X development board resource map

Backplane peripheral interface resources:

Function		parameter
System	POWER	12VDC
	KEY	1 reset button, 1 user button
	SD	1 way Micro SD card slot
	DEBUG	1-way debugging serial port, 1-way Type C debugging interface
Communication Interface	WIFI/BT	Onboard WIFI module
	5G/4G	1-way M.2 B-type socket 5G/4G module interface; 2-way SIM card holder
	Ethernet	1 channel 10/100/1000M Ethernet interface
	USB	2-way USB2.0 HOST interface, using Type-A interface; 1-way USB2.0 OTG interface, using Type-C interface
	UART	4 UART interfaces, 1 UART Debug interface
	CAN	1 channel CAN interface, lead out through the expansion interface
Multimedia interface	DISPLAY	Single-channel LVDS display interface; dual-channel LVDS display interface
	AUDIO	1-channel audio output interface
Extension ports	RPI Interface	1 way 2.54mm pitch 40PIN header, GPIO/I2C/UART/SPI/CAN

Application scenarios of Allwinner T113-S3 entry-level embedded processor:
The T113-S3 processor is equipped with 2*Cortex-A7, the main frequency is up to 1.2GHz, and supports video codecs; it is suitable for scenarios such as IoT gateways, commercial displays, energy and power, industrial control, and medical equipment.